L1
Parts Manufacturing
Non-painted parts and molding parts on the component level
L2
Piece Parts Sub Assembly
Initial assembly combining smaller components into subassemblies
L3
Chassis Sub Assembly
Metals and plastics integrated together and shipped as a chassis
L4
Kit Assembly
Chassis + PSU and/or flat cable and/or backplane shipped as a kit
L5
Enclosure Assembly & I/O Testing
All enclosure parts attached, cables integrated, I/O tested
L6
Motherboard Integration
Motherboard integrated into chassis enclosure with power-on test
L7
Add-On Card Integration
Add-on cards (GPU, NIC, etc.) integrated and tested in server barebone
L8
Hard Drive Integration
Hard drives installed and tested within the server
L9
CPU & Memory Integration
CPUs and memory modules installed and tested in the server
L10
Full Server Assembly & Testing
Full assembly, comprehensive testing, OS/software integration, delivered as a complete server
L11
Node-Level Assembly
Server nodes assembled, software loaded, integrated into racks with full cable networking and switching
L12
Rack to Multi-Rack
Multi-rack manufacturing with full networking, software loading, validation, and optimization